• 101
• MR16R0828AM0-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 8 pcs Mirrored RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 391K

• 102
• MR16R0826BN1-CK8
• Samsung Semiconductor, Inc.
• (8Mx16) x 6 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 564K

• 103
• MR16R0826BN1-CK7
• Samsung Semiconductor, Inc.
• (8Mx16) x 6 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 564K

• 104
• MR16R0826BN1-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 6 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 564K

• 105
• MR16R0826AN1-CK8
• Samsung Semiconductor, Inc.
• (8Mx16) x 6 pcs RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 15页
• 722K

• 106
• MR16R0826AN1-CK7
• Samsung Semiconductor, Inc.
• (8Mx16) x 6 pcs RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 15页
• 722K

• 107
• MR16R0826AN1-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 6 pcs RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 15页
• 722K

• 108
• MR16R0824BS0-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 602K

• 109
• MR16R0824BN1-CK8
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 564K

• 110
• MR16R0824BN1-CK7
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 564K

• 111
• MR16R0824BN1-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 564K

• 112
• MR16R0824BM0-CK8
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs Mirrored RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 414K

• 113
• MR16R0824BM0-CK7
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs Mirrored RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 414K

• 114
• MR16R0824BM0-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs Mirrored RIMM Module based on 128Mb B-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 414K

• 115
• MR16R0824AS0-CG6
• Samsung Semiconductor, Inc.
• Rambus Consumer RIMM module
• 14页
• 500K

• 116
• MR16R0824AN1-CK8
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 15页
• 722K

• 117
• MR16R0824AN1-CK7
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 15页
• 722K

• 118
• MR16R0824AN1-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 15页
• 722K

• 119
• MR16R0824AM0-CK8
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs Mirrored RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 391K

• 120
• MR16R0824AM0-CK7
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs Mirrored RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 391K

• 121
• MR16R0824AM0-CG6
• Samsung Semiconductor, Inc.
• (8Mx16) x 4 pcs Mirrored RIMM Module based on 128Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• 14页
• 391K

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